Guest Editors: Manh-Huong Phan, Nguyen Van Hieu, Anh-Tuan Le, Nguyen Phuc Duong, Yogi Shibutani, and Nguyen Hoang Luong, 2016 International Conference on Thermoelectrics. Guest Editors: Lasse Rosendahl, Donald Morelli, Jihui Yang, Hiroaki Anno, Matt Beekman, Jan D. Koenig, Xinfeng Tang, James R. Salvador, Bertrand Lenoir, Chunlei Wan, Jeff Sharp, Emmanuel Guilmeau, Hsin Wang, Jing-feng Li, Tie-Jun Zhu, David Singh, Ryoji Funahashi, Yuri Grin, and Wenqing Zhang, 2014 Electronic Materials Conference. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications. Special Issue: Second Symposium of Renewable Energy and Sustainability: Research of Solar Materials in Mexico. The Journal of Electronic Materials is a monthly peer-reviewed scientific journal that publishes studies, research, developments, and applications of materials that produce electronics. Guest Editors: Jihui Yang, Matt Beekman, Donald Morelli, James Salvador, David Singh, Hsin Wang, Emmanuel Guilmeau, Juri Grin, Bertrand Lenoir, Xinfeng Tang, Wenqing Zhang, Chunlei Wan, TieJun Zhu, Ryoji Funahashi, Takao Mori, Tsunehiro Takeuchi, Sabah Bux, Special Sections: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies; Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIII; and Advanced Materials for Power Electronics and Power Conditioning Systems, 2014 U.S. Workshop on the Physics and Chemistry of II-VI Materials. Springer Nature. Guest Editor: Ruiqin Zhang. The editor-in-chief is Shadi Shahedipour-Sandvik, SUNY Polytechnic Institute.The IEEE/TMS Journal of Electronic Materials (JEM) is jointly sponsored by the IEEE Electron Devices Society and The Minerals, Metals and Materials Society. Guest Editors: Joshua Caldwell, Nadeemullah Mahadik, Jamie Phillips, Adrienne Stiff-Roberts, Ganesh Balakrishnan, Parsian Mohseni, Patrick Shea, Shadi Shahedipour-Sandvik, Special Section: International Conference on Thermoelectrics 2018. All previously published articles are available through the Table of Contents. The Journal of Electronic Materials is soliciting proposals for Invited Review Articles. Special Section: U.S. Workshop on Physics and Chemistry of II-VI Materials 2019, Special Section: 18th Conference on Defects-Recognition, Imaging and Physics in Semiconductors (DRIP XVIII). Guest Editors: Jihui Yang, Matt Beekman, Donald Morelli, James Salvador, David Singh, Hsin Wang, Emmanuel Guilmeau, Juri Grin, Bertrand Lenoir, Xinfeng Tang, Wenqing Zhang, Chunlei Wan, TieJun Zhu, Ryoji Funahashi, Takao Mori, Tsunehiro Takeuchi, Franck Gascoin, and Shanyu Wang, TMS Special Sections: Alloys and Compounds for Thermoelectric and Solar Cell Applications IV; Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology; and Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XV. The journal is archived in Portico and via the LOCKSS initiative, which provides permanent archiving for electronic scholarly journals. Guest Editors: Joshua Caldwell, Joshua Zide, Suzanne Mohney, Jamie Phillips, F. Shadi Shahedipour-Sandvik, Nadeem Mahadik, Fareed Qhalid, Suchi Guha, Rachel Goldman, Jian Xu, Angel Yanguas-Gil, Ganesh Balakrishnan, 2015 International Conference on Thermoelectrics. © 2020 Springer Nature Switzerland AG. IEEE websites place cookies on your device to give you the best user experience. Special Topic on Materials Studies in Energy Systems. Journal of Electronic Materials | Citations: 7,438 | Published jointly by IEEE and TMS. Guest Editors: S. Sivananthan and N. K. Dhar, International Conference on Thermoelectrics 2013. Part of Springer Nature. Guest Editor: Hiroshi Nishikawa, Special Section: Electronic Materials for Renewable Energy Applications 2018, Special Section: U.S. Workshop on the Physics and Chemistry of II-VI Materials 2018, Special Section: Progress and Challenges for Emerging Integrated Energy Modules, Special Section: 60th Electronic Materials Conference 2018. Forum for rapid dissemination of the results of original research in electronic materials. Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies. Guest Editors: Angel Yanguas-Gil, Ganesh Balakrishnan, Joshua D. Cladwell, Jamie Phillips, Joshua Zide, Michael Tiscler, John Baniecki, Suzanne Mohney, and Shadi Shahedipour-Sandvik, Special Section: 3D Printing. Guest Editors: Chih Wah Kok, Wing Shan Tam, Chao Sung Lai, Jer Chyi Wang. The Journal of Electronic Materials (JEM) is a forum for rapid dissemination of the results of original research in electronic materials. Journal of Materials has ceased publication and is no longer accepting submissions. Guest Editors: Kyoung-sik (Jack) Moon, Raymond C. Rumpf, Namsoo P. Kim, and Seung-Kyum Choi, Special Sections from the 2014 TMS Annual Meeting: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies; Advanced Materials for Power Electronics and Power Conditioning Systems; and Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIII. November 2015, issue 11; October 2015, issue 10; September 2015, issue 9; August 2015, issue 8. You’re seeing our new journal sites and we’d like your opinion, please Phase Stability, Phase Transformation and Reactive Phase Formation in Electronic Materials. Guest Editors: Xinyu Liu and Aidong Shen; and 5th European Conference on Renewable Energy Systems. Journal of Electronic Materials: The mission of TMS is to promote the global science and engineering professions concerned with minerals, metals, and materials. Guest Editors: Chongxin Shan and Aidong Shen, Special Section: 61st Electronic Materials Conference 2019. Journal of Semiconductors publishes articles that emphasize semiconductor physics, materials, devices, circuits, ... and soft robotics/prostheses. Includes materials for memory, logic, display, interconnections, detectors, emitters, packaging, large stores and hard copy. 2011 Electronic Materials Conference. JPhys Materials is a new open access journal highlighting the most significant and exciting advances in materials science. Guest Editors: Joshua Caldwell, Rachel Goldman, Oana Jurchescu, Xuiling Li, Suzanne Mohney, Jamie Phillips, Grace Xing, Jian Xu, and Joshua Zide, Special Section: Mechanical Reliability of Electronic Components; Guest Editor: Narayanaswami Ranganathan, Special Sections from the 2013 TMS Annual Meeting: Lead-Free Solders; Advanced Materials for Power Electronics and Power Conditioning Systems; and Phase Stability, Phase Transformations, and Reaction Phase Formation in Electronic Materials. Sebastian, John Baniecki, Balaram Sahoo, and Ratiba Benzerga, Special Section: TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder. It benefits both specialists and non-specialists in the electronic materials field.
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